News Centre
News Type
Send your inquiry
ESD Materials in Semiconductor Industry: Wafer Handling and Chip Packaging Solutions
How ESD-safe engineering plastics protect semiconductor wafers and chips during manufacturing. Covers ESD PEEK, ESD POM, and ESD PPS applications in wafer handling, test sockets, and packaging.
Introduction
Semiconductor manufacturing is arguably the most ESD-sensitive industry in the world. A single static discharge event can destroy a wafer containing hundreds of chips, resulting in losses of tens of thousands of dollars per incident.
The Semiconductor ESD Challenge
The semiconductor industry follows ANSI/ESD S20.20 for ESD control. This standard specifies that all materials in the EPZ (ESD Protected Zone) must have surface resistance between 10^4 and 10^11 ohms. NAGOMER‘s ESD product line is engineered to the 10^6-10^8 ohm range for optimal protection.
ESD PEEK for Wafer Handling Components
PEEK is the premium material for wafer handling. Its combination of: high continuous service temperature (260°C), excellent chemical resistance to process chemicals, low outgassing, and ESD-safe formulations make it ideal for wafer carriers, process trays, and robotic end-effectors.
ESD POM for Chip Packaging and Tray Applications
ESD POM is widely used for IC chip trays, tube components, and test sockets. NAGOMER‘s NFP ESD POM adds an additional advantage: zero particle shedding. This is critical in advanced packaging facilities where contamination control is as important as ESD protection.
ESD PPS for High-Temperature Process Tools
PPS with ESD formulation is used in high-temperature process tools where components must withstand frequent thermal cycling. ESD PPS test sockets and burn-in sockets operate reliably at temperatures up to 200°C.
ANSI/ESD S20.20 Compliance in Semiconductor Facilities
Compliance with ANSI/ESD S20.20 requires documented verification of all ESD materials. NAGOMER provides full test reports with every ESD material shipment, including surface resistance measurements per ANSI/ESD S4.1-2006.
Conclusion
As semiconductor geometries shrink below 3nm, ESD sensitivity increases. The industry needs ESD materials that combine particle-free operation with stable resistance values. NAGOMER‘s NFP ESD POM and full ESD product line are designed to meet these exacting requirements.
Contact NAGOMER today for a free sample and technical datasheet.