NAGOMER’s NFP Series: China’s First Non-Powder-Release ESD POM

NAGOMER’s industry-first innovation — the NFP (No-Fall-Powder) ESD POM series — directly addresses a critical failure mode that has long plagued semiconductor manufacturers using standard ESD POM: particle contamination from powder release.

Traditional ESD POM (acetal) grades achieve conductivity by incorporating carbon black or graphite particles. Over time, especially under mechanical stress or repeated cleaning cycles, these particles dislodge and fall onto wafer surfaces — causing yield-killing defects. NAGOMER’s NFP series eliminates this mechanism through a proprietary molecular-level ESD modification technology.

Demand Trends by Region and Application

�� East Asia: The Largest and Fastest-Growing Market

South Korea, Taiwan, China, and Japan account for approximately 60% of global semiconductor fabrication capacity. ESD plastic demand in this region is concentrated in:

• 300mm wafer fab expansion: TSMC, Samsung, SMIC — each requiring millions of PEEK and ESD POM trays, carriers, and fixtures per year

• OSAT (Outsourced Semiconductor Assembly and Test): Amkor, ASE Group, JCET — high consumption of ESD nylon and ESD ABS for IC packaging fixtures

• FPD (Flat Panel Display) manufacturing: BOE, LGD, Samsung Display — ESD POM and PPS for glass substrate handling

���� North America: CHIPS Act-Driven Demand

Intel (Ohio), TSMC (Arizona), Samsung (Texas), and Micron (Idaho) fab buildouts are creating a new, large North American demand center for ESD plastics. Domestic supply qualification is a priority — creating opportunity for Chinese manufacturers with strong quality credentials to enter long-term supply agreements.

���� Europe: EUV Lithography Suppliers Drive Demand

ASML (Netherlands), Zeiss (Germany), and European MEMS fabs are driving specialized demand for ultra-high-purity ESD PEEK and PTFE components in lithography tools and precision optics enclosures.

Supply Availability and Lead Times in 2026

ESD-grade plastic supply is tightening in 2026, particularly for PEEK and POM-based ESD grades. Key supply dynamics include:

• ESD PEEK (K6B): Lead times have extended from 2–3 weeks to 4–6 weeks for some sizes as fab qualification programs absorb available inventory

• ESD POM: Supply generally adequate, but NFP-series availability remains limited to NAGOMER production — no comparable product exists at other Chinese manufacturers

• ESD PEI and ESD PPS: Niche but growing demand; most major manufacturers maintaining adequate stock

• ESD PA6: Highest volume ESD material — well-supplied by multiple manufacturers

Conclusion

The semiconductor industry’s unprecedented expansion cycle is creating a structural, multi-year tailwind for ESD engineering plastic demand. Manufacturers that can supply certified ESD grades with traceable test documentation, consistent quality, and reliable delivery windows will find strong and growing demand from global fab operators.

NAGOMER’s position as China’s only manufacturer of NFP non-powder ESD POM, combined with its full ESD-grade product portfolio, positions it uniquely to serve the world’s most demanding semiconductor supply chains.